04651.25DR
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Краткое описание:
Fuse Chip Slow Blow Acting 1.25A 250V SMD Solder Pad 12.1 X 4.5mm Ceramic T/R PSE/UL
Дополнительная информация
Fuse Chip Slow Blow Acting 1.25A 250V SMD Solder Pad 12.1 X 4.5mm Ceramic T/R PSE/UL
| RoHS | Compliant |
| Mount | Surface Mount |
| Width | 0.177inch |
| Height | 0.177inch |
| Length | 0.476inch |
| Series | NANO²® 465 |
| Current | 1.25A |
| Approvals | PSE, UMF |
| Lead Free | Lead Free |
| Packaging | Tape and Reel |
| Resistance | 83mR |
| Fuse Current | 1.25A |
| Package/Case | SMD/SMT |
| Current Rating | 1.25A |
| RoHS Compliant | Yes |
| DC Rated Voltage | 250V |
| Package Quantity | 1500 |
| DC Cold Resistance | 83mR |
| Blow Characteristic | TIME DELAY |
| Voltage Rating (AC) | 250V |
| Reach SVHC Compliant | Unknown |
| Max Operating Temperature | 125°C |
| Min Operating Temperature | -55°C |
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