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Краткое описание:
SIL PAD TSP Q2000 - Glass-Reinforced Grease Replacement Thermal Interface
Дополнительная информация
BERGQUIST SIL PAD TSP Q2000 (formerly Q-PAD 3) is a glass-reinforced grease replacement thermal interface material. It is a silicone elastomer designed to eliminate the problems associated with thermal grease, such as contamination of electronic assemblies and reflow solder baths. It features a fiberglass reinforcement carrier for physical integrity and ease of handling during application.
| RoHS | Compliant |
| Hardness | 86Shore A |
| Thickness | 0.127mm |
| Thermal Impedance | 0.35°C-in2/W @ 50 psi |
| Volume Resistivity | 1x10^2ohm-meter |
| Flammability Rating | UL 94 V-0 |
| Thermal Conductivity | 2.0W/m-K |
| Operating Temperature Range | -60 to 180°C |
| Dielectric Breakdown Voltage | Non-InsulatingVac |
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