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Краткое описание:
Fuse Chip Slow Blow Acting 2.5A 277V SMD Solder Pad 16 X 5.3mm Ceramic T/R Automotive UL/VDE
Дополнительная информация
Fuse Chip Slow Blow Acting 2.5A 277V SMD Solder Pad 16 X 5.3mm Ceramic T/R Automotive UL/VDE
| RoHS | Compliant |
| Mount | Surface Mount |
| Width | 5.35mm |
| Height | 5.35mm |
| Length | 16mm |
| Series | UMT-H |
| Weight | 0.042329oz |
| Packaging | Tape and Reel |
| Fuse Current | 2.5A |
| Package/Case | SMD/SMT |
| Body Material | Ceramic |
| Current Rating | 2.5A |
| RoHS Compliant | Yes |
| Voltage Rating | 277V |
| DC Rated Voltage | 125V |
| Package Quantity | 1500 |
| Terminal Material | Tin |
| Blow Characteristic | TIME DELAY |
| Voltage Rating (AC) | 277V |
| Reach SVHC Compliant | No |
| Max Operating Temperature | 125°C |
| Min Operating Temperature | -55°C |
