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Краткое описание:
Heat Sink Passive BGA/PGA/QFP Thin Adhesive Copper
Дополнительная информация
Heat Sink Passive BGA/PGA/QFP Thin Adhesive Copper
| RoHS | Compliant |
| Color | Black |
| Mount | Adhesive |
| Width | 12.7mm |
| Height | 0.33mm |
| Length | 76.2mm |
| Material | Copper |
| Package/Case | BGA |
| RoHS Compliant | Yes |
| Contact Plating | Tin, Matte |