342000F00000
Краткое описание:
Heat Sink Passive BGA/PGA/QFP Thin Adhesive Copper
Дополнительная информация
Heat Sink Passive BGA/PGA/QFP Thin Adhesive Copper
| RoHS | Not CompliantNo |
| Depth | 25.4mm |
| Mount | Adhesive |
| Length | 101.6mm |
| Material | Copper |
| Packaging | Bulk |
| Package/Case | BGA |
| RoHS Compliant | No |
| Radiation Hardening | No |