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Краткое описание:
Heat Sink Passive BGA/PGA/QFP Thin Adhesive Copper
Дополнительная информация
Heat Sink Passive BGA/PGA/QFP Thin Adhesive Copper
| RoHS | Not CompliantNo |
| Depth | 38.1mm |
| Mount | Adhesive |
| Length | 101.6mm |
| Material | Copper |
| Packaging | Bulk |
| Package/Case | BGA |
| Radiation Hardening | No |
