THERM-A-GAP™ GEL 45 is a single-component, fully cured, dispensable thermal interface material designed for high-performance heat transfer in electronic modules. It features a thermal conductivity of 4.5 W/m-K and is optimized for automated dispensing to fill complex geometries and various gap thicknesses. The material requires ultra-low compressive force to deflect, minimizing stress on sensitive components and solder joints. It is room temperature stable and does not require secondary curing, offering ease of rework and long-term reliability in applications such as automotive ECUs, power supplies, and high-speed processors.
| RoHS |
Compliant |
| Color |
Black |
| Flow Rate |
55g/min |
| Shelf Life |
18months |
| Fill Volume |
10cc |
| Heat Capacity |
1J/g-K |
| Outgassing (TML) |
0.15% |
| Specific Gravity |
3.1 |
| Dissipation Factor |
0.002 @ 100 kHz |
| Volume Resistivity |
10^14ohm-cm |
| Dielectric Constant |
7.0 @ 100 kHz |
| Dielectric Strength |
200VAC/mil |
| Flammability Rating |
UL 94 V-0 |
| Thermal Conductivity |
4.5W/m-K |
| Operating Temperature Range |
-55 to 200°C |
| Coefficient of Thermal Expansion |
150ppm/K |
| Typical Minimum Bondline Thickness |
0.089mm |