658-35AB
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Краткое описание:
BGA Heat Sink, Pin Fin, 27.9mm Sq, 8.89mm H, 3°C/W, Al
Дополнительная информация
Passive pin fin array heat sink designed for BGA packages. Features omnidirectional airflow with a natural thermal resistance of 3°C/W and 3°C/W at 100 LFM forced air. Constructed from anodized aluminum with a black finish, this square-shaped heat sink measures 27.9mm in length and width, with a height of 8.89mm. Mounts via adhesive and is RoHS compliant.
| RoHS | Compliant |
| Type | Passive |
| Color | Black |
| Mount | Adhesive |
| Shape | Square, Fins |
| Width | 27.9mm |
| Finish | Anodized |
| Height | 8.89mm |
| Length | 27.9mm |
| Series | 658 |
| Material | Aluminium, Anodized |
| Lead Free | Lead Free |
| Packaging | Bulk |
| Package/Case | BGA |
| Package Cooled | BGA |
| RoHS Compliant | Yes |
| Reach SVHC Compliant | No |
| Natural Thermal Resistance | 3°C/W |
| Thermal Resistance @ Forced Air Flow (100 LFM) | 3°C/W |
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