7109DG
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Краткое описание:
Passive Heat Sink TO-263 SMD Copper Tin 11°C/W
Дополнительная информация
Passive heat sink designed for TO-263 SMD packages. Features a finned, rectangular copper and aluminum construction with matte tin plating for efficient thermal dissipation. Offers a natural thermal resistance of 11°C/W and 3°C/W at 100 LFM forced air. Surface mountable with dimensions of 25.4mm length, 19.38mm depth, and 11.43mm height. RoHS compliant and lead-free.
| RoHS | Compliant |
| Type | Passive |
| Color | Black |
| Depth | 19.38mm |
| Mount | Surface Mount |
| Shape | Fins, Rectangular |
| Width | 1inch |
| Finish | Tin |
| Height | 11.43mm |
| Length | 25.4mm |
| Series | 7109 |
| Material | Copper, Tin, Matte, Aluminium |
| Lead Free | Lead Free |
| Packaging | Bulk |
| Package/Case | TO-263 |
| RoHS Compliant | Yes |
| Contact Plating | Tin, Matte |
| Height Off Base | 0.45inch |
| Package Quantity | 500 |
| Radiation Hardening | No |
| Reach SVHC Compliant | No |
| Natural Thermal Resistance | 11°C/W |
| Thermal Resistance @ Forced Air Flow (100 LFM) | 3°C/W |
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