74AHC157BQ,115
Дополнительная информация
| PCB | 16 |
| ECCN | EAR99 |
| PPAP | No |
| Jedec | MO-241 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Mounting | Surface Mount |
| Polarity | Non-Inverting |
| Cage Code | H2HX9 |
| Pin Count | 16 |
| Automotive | No |
| Lead Shape | No Lead |
| Schedule B | 8542390000 |
| Logic Family | AHC |
| Package/Case | DHVQFN EP |
| AEC Qualified | No |
| Configuration | 4 x 2:1 |
| RoHS Versions | 2011/65/EU, 2015/863 |
| Logic Function | Multiplexer |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Basic Package Type | Non-Lead-Frame SMT |
| Package Width (mm) | 2.6(Max) |
| Process Technology | CMOS |
| Package Description | Depopulated Heat Sink Very Thin Quad Flat No Lead Package, Exposed Pad |
| Package Family Name | QFN |
| Package Height (mm) | 0.95(Max) |
| Package Length (mm) | 3.6(Max) |
| Seated Plane Height (mm) | 1(Max) |
| Max Operating Temperature | 125°C |
| Min Operating Temperature | -40°C |
| Number of Inputs per Chip | 8 |
| Number of Outputs per Chip | 4 |
| Number of Elements per Chip | 1 |
Если у вас не открывается документ, нажмите, чтобы открыть файл в новой вкладке.