8331D is an electrically conductive, 2-part silver epoxy adhesive that is smooth, non-sagging, and thixotropic. It bonds well to a wide variety of substrates and allows for quick, cold-soldering repairs. It is frequently used as a solder replacement for bonding heat-sensitive electronic components or for making conductive connections where soldering is not an option, such as when bonding to glass, soft metals, or plastics. It provides excellent EMI/RFI shielding and is highly effective for filling seams between metal plates.
| RoHS |
Compliant |
| Svhc |
Free |
| Mix Ratio |
1:1By Volume |
| Net Volume |
50mL |
| Net Weight |
120g |
| Shelf Life |
1095days |
| Working Time |
20minutes |
| Density (Mixed) |
2.4g/mL |
| Viscosity (Mixed) |
130Pa·s |
| Cure Time @ 65 °C |
10minutes |
| Thermal Conductivity |
1.5W/m·K |
| Cure Time @ Room Temperature |
6hours |