88E1111-B2-BAB1I000
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Краткое описание:
1Gbps Ethernet PHY, 1-CH, 10/100/1000Mbps, 117-Pin TFBGA
Дополнительная информация
1-Channel Ethernet PHY supporting 10/100/1000 Mbps speeds, compliant with IEEE 802.3, 802.3u, and 1149.1 standards. Features GMII/TBI/RGMII/RTBI/SGMII Ethernet interface and JTAG support. Housed in a 117-pin TFBGA package with a 1mm pin pitch, measuring 14x10x0.89mm. Operates with typical supply voltages of 1V, 1.2V, and 2.5V, and has a maximum power dissipation of 750mW. Suitable for surface mount applications with an operating temperature range of -40°C to 85°C.
| PCB | 117 |
| ECCN | 5A991.b.1 |
| PPAP | No |
| EU RoHS | Yes |
| HTS Code | 8542310001 |
| Mounting | Surface Mount |
| Cage Code | 54BL8 |
| Pin Count | 117 |
| Automotive | No |
| Lead Shape | Ball |
| Schedule B | 8542310000 |
| JTAG Support | Yes |
| Package/Case | TFBGA |
| AEC Qualified | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
| Ethernet Speed | 10Mbps/100Mbps/1000Mbps |
| Integrated CDR | No |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Maximum Data Rate | 1Gbps |
| Power Supply Type | Analog|Digital |
| Typical Data Rate | 10/100/1000Mbps |
| Basic Package Type | Ball Grid Array |
| Package Width (mm) | 10 |
| Standard Supported | 10BASE-T|100BASE-TX|1000BASE-T|IEEE 802.3|IEEE 802.3u|IEEE 1149.1 |
| Package Description | Thin Fine Pitch Ball Grid Array |
| Package Family Name | BGA |
| Package Height (mm) | 0.89 |
| Package Length (mm) | 14 |
| Radiation Hardening | No |
| Overhead Octet Support | No |
| Ethernet Interface Type | GMII/TBI/RGMII/RTBI/SGMII |
| PHY Line Side Interface | No |
| Seated Plane Height (mm) | 1.54(Max) |
| Max Operating Temperature | 85°C |
| Maximum Power Dissipation | 750mW |
| Min Operating Temperature | -40°C |
| Number of Channels per Chip | 1 |
| Typical Operating Supply Voltage | 1|1.2|2.5V |
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