XSoft thermal interface material, a silicone-based putty, offers a thermal conductivity of 3 W/mK. Designed for general thermal management applications, this white, square-shaped material features a thickness of 0.06 inches. It operates effectively across a wide temperature range, from -45°C to 200°C, with a natural thermal resistance of 0.53°C/W.
| RoHS |
Compliant |
| Color |
White |
| Shape |
Square |
| Series |
TPutty™ 502 |
| Material |
Silicone |
| Thickness |
0.06inch |
| Package/Case |
502 |
| Package Quantity |
1 |
| Max Operating Temperature |
200°C |
| Min Operating Temperature |
-45°C |
| Natural Thermal Resistance |
0.53°C/W |