The Tflex HD90000 series is a high-performance thermal gap filler that combines 7.5 W/m-K thermal conductivity with superior pressure versus deflection characteristics. It is designed to minimize board and component stress while providing high reliability. This silicone-based, ceramic-filled material is naturally tacky on both sides and maintains its thermal performance under high temperature and humidity conditions.
| RoHS |
Compliant |
| Color |
Grey |
| Density |
3.5g/cc |
| Hardness |
27Shore 00 |
| Thickness |
2.03mm |
| Dimensions |
228.6 x 228.6mm |
| Flammability Rating |
UL 94 V-0 |
| Thermal Conductivity |
7.5W/m-K |
| Operating Temperature Range |
-50 to 125°C |
| Dielectric Breakdown Voltage |
> 5000Vac/mm |