A17752-12
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Краткое описание:
Tflex HD90000 Thermal Gap Pad, 7.5 W/m-K, 0.120 inch (3.05mm)
Дополнительная информация
The Tflex HD90000 is a high-performance thermal gap filler in the Tflex series. It features a silicone elastomer base with a thermal conductivity of 7.5 W/m-K. The material is designed to be soft and compliant, minimizing board and component stress while providing high thermal transfer. It is naturally tacky on both sides and maintains its properties in operating temperatures up to 125°C.
| RoHS | Compliant |
| Color | Greynull |
| REACH | SVHC Free |
| Density | 3.5g/cc |
| Hardness | 27Shore 00 |
| Thickness | 0.120inch |
| Standard Sheet Size | 9 x 9inch |
| Thermal Conductivity | 7.5W/m-K |
| Operating Temperature Max | 125Celsius |
| Operating Temperature Min | -40Celsius |