Tflex HD90000 is a high-performance silicone-based thermal gap filler that combines a high thermal conductivity of 7.5 W/mK with superior pressure versus deflection characteristics. This combination allows for minimal stress on components while yielding low thermal resistance. The material is ceramic-filled, provides excellent surface wetting for low contact resistance, and is characterized by low outgassing and low D3-D20 levels. It is designed to bridge air gaps and irregularities in electronic assemblies to enhance cooling efficiency.
| RoHS |
Compliant |
| Color |
Gray |
| REACH |
Compliant |
| Density |
3.5g/cc |
| Hardness |
32Shore 00 |
| Lead Free |
Yes |
| Thickness |
5.00mm |
| Dimensions |
228.6 x 228.6mm |
| Volume Resistivity |
8.73 x 10^13Ohm-cm |
| Dielectric Constant |
8.14@ 1 MHz |
| Flammability Rating |
UL 94 V-0 |
| Thermal Conductivity |
7.5W/m-K |
| Operating Temperature Range |
-65 to 125°C |