A18213-06
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Краткое описание:
Tflex SF10, 1.5mm Thermal Gap Filler Pad, 10 W/mK
Дополнительная информация
A18213-06 is a high-performance, silicone-free thermal gap filler from the Tflex SF10 series. It is designed for applications where silicone outgassing or migration is prohibited. This material provides a high thermal conductivity of 10 W/mK and is compliant, allowing it to bridge gaps between heat-generating components and heat sinks or chassis while minimizing stress on components.
| Ul | UL 94V-0 |
| RoHS | Compliant |
| Color | Grey |
| Density | 3.7g/cc |
| Hardness | 73Shore 00 |
| Thickness | 1.50mm |
| Silicone Free | Yes |
| Volume Resistivity | 10^13ohm-cm |
| Flammability Rating | V-0 |
| Thermal Conductivity | 10W/m-K |
| Operating Temperature Range | -40 to 125°C |