AD6642BBCZ
Дополнительная информация
| PCB | 144 |
| ECCN | 5A991.b |
| PPAP | No |
| Jedec | MO-205AC |
| EU RoHS | Yes |
| Category | Receiver |
| HTS Code | 8542390001 |
| Mounting | Surface Mount |
| Cage Code | 24355 |
| Pin Count | 144 |
| Automotive | No |
| Lead Shape | Ball |
| Schedule B | 8542390000 |
| Package/Case | CSP-BGA |
| AEC Qualified | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
| Pin Pitch (mm) | 0.8 |
| Package Material | Plastic |
| Basic Package Type | Ball Grid Array |
| Package Width (mm) | 10 |
| Package Description | Chip Scale Ball Grid Array Package |
| Package Family Name | BGA |
| Package Height (mm) | 1(Max) |
| Package Length (mm) | 10 |
| Radiation Hardening | No |
| Operating Band Frequency | 40 to 70MHz |
| Seated Plane Height (mm) | 1.4(Max) |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Max Operating Supply Voltage | 1.9V |
| Min Operating Supply Voltage | 1.7V |
| Maximum RF Operating Frequency | 70MHz |
| Typical Operating Supply Voltage | 1.8V |
| Maximum RF Operating Frequency Range | 0.04 to 100MHz |
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