ADP150ACBZ-1.8-R7
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Краткое описание:
1.8V LDO Regulator, 0.15A, 4-Pin WLCSP, Pos, Fixed
Дополнительная информация
1.8V positive fixed output LDO regulator, offering 0.15A maximum output current. This wafer-level chip scale package (WLCSP) component features a 4-pin WLCSP package with a 0.76mm x 0.76mm footprint and 0.4mm pin pitch. It operates with a minimum input voltage of 2.2V and a maximum of 5.5V, boasting a typical dropout voltage of 0.105V at 150mA. Key protections include current limit, short circuit protection, and thermal protection, with an operating temperature range of -40°C to 125°C.
| PCB | 4 |
| ECCN | EAR99 |
| PPAP | No |
| Type | LDO |
| EU RoHS | Yes |
| Accuracy | ±1% |
| HTS Code | 8542390001 |
| Mounting | Surface Mount |
| Polarity | Positive |
| Cage Code | 24355 |
| Pin Count | 4 |
| Automotive | No |
| Lead Shape | Ball |
| Schedule B | 8542390000 |
| Output Type | Fixed |
| Package/Case | WLCSP |
| AEC Qualified | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
| Output Voltage | 1.8V |
| Pin Pitch (mm) | 0.4 |
| Line Regulation | 0.05%/V |
| Load Regulation | 0.002%/mA(Typ) |
| Package Material | Plastic |
| Special Features | Current Limit|Short Circuit Protection|Thermal Protection |
| Number of Outputs | 1 |
| Basic Package Type | Ball Grid Array |
| Package Width (mm) | 0.76 |
| Junction to Ambient | 260°C/W |
| Package Description | Wafer Level Chip Scale Package |
| Package Family Name | BGA |
| Package Height (mm) | 0.4 |
| Package Length (mm) | 0.76 |
| Radiation Hardening | No |
| Maximum Input Voltage | 5.5V |
| Minimum Input Voltage | 2.2V |
| Maximum Output Current | 0.15A |
| Seated Plane Height (mm) | 0.6 |
| Max Operating Temperature | 125°C |
| Min Operating Temperature | -40°C |
| Typical Dropout Voltage @ Current | 0.105@150mAV |
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