ADSP-BF514BBCZ-3
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Краткое описание:
DSP 16/32-bit Fixed-Point 300MHz 168-Pin CSP-BGA SM
Дополнительная информация
168-pin CSP-BGA digital signal processor (DSP) operating at a maximum speed of 300 MHz. Features a 16/32-bit data bus width, fixed-point numeric format, and a Modified Harvard instruction set architecture. Includes 48KB RAM, 40 programmable I/Os, and supports SPI and UART interfaces. Surface mountable with a 12mm x 12mm x 1.26mm plastic package.
| CAN | 0 |
| I2C | 0 |
| I2S | 0 |
| PCB | 168 |
| SPI | 2 |
| USB | 0 |
| ECCN | 3A991.a.2 |
| PPAP | No |
| UART | 2 |
| Jedec | MO-275GGAB-1 |
| USART | 0 |
| EU RoHS | Yes |
| Ethernet | 0 |
| HTS Code | 8542310001 |
| Mounting | Surface Mount |
| RAM Size | 48KB |
| Cage Code | 24355 |
| Pin Count | 168 |
| Automotive | No |
| Lead Shape | Ball |
| Schedule B | 8542310000 |
| Family Name | ADSP-BF51x |
| Package/Case | CSP-BGA |
| AEC Qualified | No |
| Maximum Speed | 300MHz |
| RoHS Versions | 2011/65/EU, 2015/863 |
| Data Bus Width | 16|32bit |
| Interface Type | SPI/UART |
| Pin Pitch (mm) | 0.8 |
| Programmability | No |
| Package Material | Plastic |
| Basic Package Type | Ball Grid Array |
| Package Width (mm) | 12 |
| Package Description | Chip Scale Ball Grid Array Package |
| Package Family Name | BGA |
| Package Height (mm) | 1.26 |
| Package Length (mm) | 12 |
| Program Memory Type | ROMLess |
| Radiation Hardening | No |
| Device Input Clock Speed | 300MHz |
| Seated Plane Height (mm) | 1.6 |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Number of Programmable I/Os | 40 |
| Instruction Set Architecture | Modified Harvard |
| Numeric and Arithmetic Format | Fixed-Point |
| Typical Operating Supply Voltage | 1.8|2.5|3.3|7V |
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