This heat sink is a passive device made from aluminum alloy 6063, with a forged fin style and black anodized finish. It is designed for BGA device cooling and features an adhesive attachment method. The heat sink measures 18.6mm in length and depth, and 32.6mm in height. It is mounted using a clip method.
| RoHS |
Yes |
| Type |
Passive |
| Finish |
Black Anodized |
| Height |
32.6mm |
| Material |
Aluminum Alloy 6063 |
| Mounting |
Clip |
| Fin Style |
Forged |
| RoHS Version |
2011/65/EU |
| Device Cooled |
BGA |
| Product Depth |
18.6mm |
| Product Length |
18.6mm |
| Attachment Method |
Adhesive |