This aluminum alloy 6063 heat sink is designed for BGA device cooling and features a forged fin style. It is attached via adhesive and has a black anodized finish. The heat sink measures 34.6mm in length and 22.6mm in height, with a mounting style of clip. It is suitable for general thermal management applications.
| RoHS |
Yes |
| Type |
Passive |
| Finish |
Black Anodized |
| Height |
22.6mm |
| Material |
Aluminum Alloy 6063 |
| Mounting |
Clip |
| Fin Style |
Forged |
| RoHS Version |
2011/65/EU |
| Device Cooled |
BGA |
| Product Depth |
34.6mm |
| Product Length |
34.6mm |
| Attachment Method |
Adhesive |