This aluminum alloy 6063 heat sink features a forged fin style and is designed for BGA device cooling. It measures 37.1mm in length and 32.6mm in height, with a product depth of 37.1mm. The heat sink is finished in black anodized and is attached via adhesive method, making it suitable for applications requiring a secure and reliable thermal management solution.
| RoHS |
Yes |
| Type |
Passive |
| Finish |
Black Anodized |
| Height |
32.6mm |
| Material |
Aluminum Alloy 6063 |
| Mounting |
Adhesive |
| Fin Style |
Forged |
| RoHS Version |
2011/65/EU |
| Device Cooled |
BGA |
| Product Depth |
37.1mm |
| Product Length |
37.1mm |
| Attachment Method |
Adhesive |