APR27-27-15CB/A01
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Краткое описание:
BGA Adhesive Thermal Management Device 26.6mm x 26.6mm 12.1°C/W
Дополнительная информация
This BGA adhesive thermal management device has a package size of 26.6mm x 26.6mm and a natural thermal resistance of 12.1°C/W. It is made from aluminium and nylon materials and features an anodized finish. The device is packaged in bulk and is not radiation hardened. It is designed for use as a heat sink for ASICs.
| RoHS | Compliant |
| Type | Passive |
| Depth | 26.6mm |
| Mount | Adhesive |
| Shape | Square, Fins |
| Finish | Anodized |
| Height | 14.6mm |
| Length | 26.6mm |
| Series | APR |
| Material | Aluminium, Nylon |
| Packaging | Bulk |
| Package/Case | BGA |
| Package Cooled | ASIC |
| Radiation Hardening | No |
| Natural Thermal Resistance | 12.1°C/W |
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