This heat sink is a passive device made from aluminum 6063 material with a pin array fin style. It is designed for BGA attachment and features a black anodized finish. The product measures 37.5mm in length and depth, and 27.6mm in height. It is suitable for general use in thermal management applications.
| RoHS |
Yes |
| Type |
Passive |
| Finish |
Black Anodized |
| Height |
27.6mm |
| Material |
Aluminum 6063 |
| Fin Style |
Pin Array |
| RoHS Version |
2011/65/EU, 2015/863 |
| Device Cooled |
BGA |
| Product Depth |
37.5mm |
| Product Length |
37.5mm |
| Attachment Method |
Clip |