This aluminum heat sink is a passive thermal management device made from 6063 material. It features a pin array fin style and is designed for BGA attachment via a clip method. The heat sink measures 49.6mm in length and depth, with a height of 20.6mm. The finish is black anodized for corrosion resistance.
| RoHS |
Yes |
| Type |
Passive |
| Finish |
Black Anodized |
| Height |
20.6mm |
| Material |
Aluminum 6063 |
| Fin Style |
Pin Array |
| RoHS Version |
2011/65/EU, 2015/863 |
| Device Cooled |
BGA |
| Product Depth |
49.6mm |
| Product Length |
49.6mm |
| Attachment Method |
Clip |