AS8FLC1M32BQ-90/XT
Краткое описание:
32Mbit Parallel Flash Module, 90ns, 32-bit, Ceramic CQFP, 3.3V
Дополнительная информация
32Mbit parallel Flash Module featuring a 1Mx32 organization and 32-bit data bus width. This surface-mount component utilizes a Ceramic Quad Flat Package (CQFP) with 68 pins, measuring 22.61mm x 22.61mm x 3.18mm. It offers a maximum access time of 90 ns and operates at a typical 3.3V supply voltage, with a maximum operating current of 140 mA. Designed for demanding environments, it functions across a temperature range of -55°C to 125°C.
| PCB | 68 |
| ECCN | 4A994.a |
| PPAP | No |
| HTS Code | 8473301140 |
| Mounting | Surface Mount |
| Cage Code | 0LRZ0 |
| Pin Count | 68 |
| Automotive | No |
| Schedule B | 8473300002 |
| ECC Support | No |
| Subcategory | Parallel |
| Chip Density | 8Mbit |
| Organization | 1Mx32 |
| Package/Case | CQFP |
| AEC Qualified | No |
| Main Category | Flash Module |
| RoHS Versions | 2002/95/EC |
| Total Density | 32Mbit |
| Data Bus Width | 32bit |
| Package Material | Ceramic |
| Chip Package Type | CQFP |
| Basic Package Type | Lead-Frame SMT |
| Chip Configuration | 1Mx8 |
| Package Width (mm) | 22.61(Max) |
| Maximum Access Time | 90ns |
| Package Description | Ceramic Quad Flat Package |
| Package Family Name | QFP |
| Package Height (mm) | 3.18(Max) |
| Package Length (mm) | 22.61(Max) |
| Radiation Hardening | No |
| Seated Plane Height (mm) | 3.56(Max) |
| Max Operating Temperature | 125°C |
| Maximum Operating Current | 140mA |
| Min Operating Temperature | -55°C |
| Number of Chip per Module | 4 |
| Typical Operating Supply Voltage | 3.3V |
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