ATS-51290R-C1-R0
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Краткое описание:
BGA Package Heat Sink, 29mm x 29mm x 19.5mm, Anodized Aluminium, Clip Mount
Дополнительная информация
The maxiGRIP, maxiFLOW heat sink is a passive thermal management component with a BGA package and clip mount. It is made from anodized aluminium with a square shape and fins. The heat sink has a thermal resistance of 3.4°C/W at 100 LFM forced air flow. It is available in bulk packaging with 10 units per package.
| RoHS | Not CompliantNo |
| Type | Passive |
| Color | Black |
| Depth | 29mm |
| Mount | Clip |
| Shape | Square, Fins |
| Width | 1.142inch |
| Finish | Anodized |
| Height | 19.5mm |
| Length | 29mm |
| Series | maxiGRIP, maxiFLOW |
| Material | Aluminium |
| Packaging | Bulk |
| Package/Case | BGA |
| Package Cooled | BGA |
| RoHS Compliant | No |
| Height Off Base | 0.768inch |
| Package Quantity | 10 |
| Radiation Hardening | No |
| Thermal Resistance @ Forced Air Flow (100 LFM) | 3.4°C/W |
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