ATS-52300B-C1-R0
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maxiFLOW BGA Heat Sink, 30mm x 30mm x 7.5mm, Adhesive Mount, 7.1°C/W Thermal Resistance
Дополнительная информация
The maxiFLOW BGA heat sink is a passive thermal management component with a package cooled BGA design. It measures 30mm in length, 30mm in depth, and 7.5mm in height, with a width of 1.181inch. The heat sink is made of aluminium and features a square shape with fins. It is designed for adhesive mount and is available in a bulk packaging quantity of 100 units. The thermal resistance of the heat sink is 7.1°C/W at a forced air flow of 100 LFM.
| RoHS | Not CompliantNo |
| Type | Passive |
| Color | Blue |
| Depth | 30mm |
| Mount | Adhesive |
| Shape | Square, Fins |
| Width | 1.181inch |
| Height | 7.5mm |
| Length | 30mm |
| Series | maxiFLOW |
| Material | Aluminium |
| Packaging | Bulk |
| Package/Case | BGA |
| Package Cooled | BGA |
| RoHS Compliant | No |
| Height Off Base | 0.295inch |
| Package Quantity | 100 |
| Radiation Hardening | No |
| Thermal Resistance @ Forced Air Flow (100 LFM) | 7.1°C/W |
