ATS-53210K-C1-R0
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maxiGRIP BGA Heat Sink, 11.1°C/W Thermal Resistance, Clip Mount
Дополнительная информация
The maxiGRIP BGA heat sink is a passive thermal management component with a thermal resistance of 11.1°C/W at 100 LFM forced air flow. It features a BGA package, is made of anodized aluminium, and has a square shape with fins. The heat sink is available in bulk packaging with 100 units per package and is not radiation hardened or RoHS compliant.
| RoHS | Not CompliantNo |
| Type | Passive |
| Color | Black |
| Depth | 21mm |
| Mount | Clip |
| Shape | Square, Fins |
| Width | 0.827inch |
| Finish | Anodized |
| Height | 14.5mm |
| Length | 21mm |
| Series | maxiGRIP |
| Material | Aluminium |
| Packaging | Bulk |
| Package/Case | BGA |
| Package Cooled | BGA |
| RoHS Compliant | No |
| Height Off Base | 0.571inch |
| Package Quantity | 100 |
| Radiation Hardening | No |
| Thermal Resistance @ Forced Air Flow (100 LFM) | 11.1°C/W |
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