ATS-53300K-C1-R0
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maxiGRIP BGA Heat Sink, 30mm x 30mm x 14.5mm, Anodized Aluminium, Clip Mount
Дополнительная информация
The maxiGRIP BGA heat sink is a passive thermal management component with a package quantity of 100 units per bulk packaging. It features a BGA package case with a thermal resistance of 6.9°C/W at 100 LFM forced air flow. The heat sink measures 30mm in length and width, and 14.5mm in height, with a depth of 30mm and a width of 1.181inch. It is made of anodized aluminium material and has a black color finish.
| RoHS | Not CompliantNo |
| Type | Passive |
| Color | Black |
| Depth | 30mm |
| Mount | Clip |
| Shape | Square, Fins |
| Width | 1.181inch |
| Finish | Anodized |
| Height | 14.5mm |
| Length | 30mm |
| Series | maxiGRIP |
| Material | Aluminium |
| Packaging | Bulk |
| Package/Case | BGA |
| Package Cooled | BGA |
| RoHS Compliant | No |
| Height Off Base | 0.571inch |
| Package Quantity | 100 |
| Radiation Hardening | No |
| Thermal Resistance @ Forced Air Flow (100 LFM) | 6.9°C/W |
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