ATS-54170R-C1-R0
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maxiFLOW BGA Heat Sink, 9.3°C/W Thermal Resistance, Adhesive Mount
Дополнительная информация
The maxiFLOW BGA heat sink is a passive thermal management component with a thermal resistance of 9.3°C/W at 100 LFM forced air flow. It features a BGA package and is mounted via adhesive. Constructed from anodized aluminium, the heat sink measures 17mm in length and 0.669inch in width, with a height of 0.768inch off base. The maxiFLOW series is designed for general use.
| RoHS | Not CompliantNo |
| Type | Passive |
| Depth | 17mm |
| Mount | Adhesive |
| Shape | Square, Fins |
| Width | 0.669inch |
| Finish | Anodized |
| Length | 17mm |
| Series | maxiFLOW |
| Material | Aluminium |
| Package/Case | BGA |
| Package Cooled | BGA |
| RoHS Compliant | No |
| Height Off Base | 0.768inch |
| Radiation Hardening | No |
| Thermal Resistance @ Forced Air Flow (100 LFM) | 9.3°C/W |
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