ATS-54300K-C1-R0
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BGA Thermal Management Heat Sink, 30mm x 30mm x 0.571inch, Anodized Aluminium, Adhesive Mount
Дополнительная информация
This heat sink features a BGA package cooled design, with a thermal resistance of 6.9°C/W at 100 LFM forced air flow. It measures 30mm in length and width, and 0.571inch in height off base. The heat sink is constructed from anodized aluminium material, with a square shape and fins. It is designed for adhesive mount and is suitable for general use.
| RoHS | Not CompliantNo |
| Type | Passive |
| Depth | 30mm |
| Mount | Adhesive |
| Shape | Square, Fins |
| Width | 1.181inch |
| Finish | Anodized |
| Length | 30mm |
| Material | Aluminium |
| Package/Case | BGA |
| Package Cooled | BGA |
| RoHS Compliant | No |
| Height Off Base | 0.571inch |
| Radiation Hardening | No |
| Thermal Resistance @ Forced Air Flow (100 LFM) | 6.9°C/W |
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