ATS-55270K-C1-R0
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Краткое описание:
Thermal Management Heat Sink, BGA, 8.3°C/W, 27mm x 27mm x 1.063inch
Дополнительная информация
This passive heat sink is designed for BGA packages, offering a thermal resistance of 8.3°C/W at 100 LFM forced air flow. Constructed from anodized aluminium with a square shape and fins, it measures 27mm in length and width, and 1.063inch in height off base. The heat sink is mounted via adhesive, making it suitable for a range of applications.
| RoHS | Not CompliantNo |
| Type | Passive |
| Depth | 27mm |
| Mount | Adhesive |
| Shape | Square, Fins |
| Width | 1.063inch |
| Finish | Anodized |
| Length | 27mm |
| Material | Aluminium |
| Package/Case | BGA |
| Package Cooled | BGA |
| RoHS Compliant | No |
| Height Off Base | 0.571inch |
| Radiation Hardening | No |
| Thermal Resistance @ Forced Air Flow (100 LFM) | 8.3°C/W |
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