BDN15-3CB/A01
Производится
Увеличить
Краткое описание:
Heat Sink Passive BGA/PGA/PLCC/QFP Pin Array Adhesive 15.1°C/W Black Anodized
Дополнительная информация
Heat Sink Passive BGA/PGA/PLCC/QFP Pin Array Adhesive 15.1°C/W Black Anodized
| RoHS | Not Compliant |
| Type | Passive |
| Color | Black |
| Depth | 38.354mm |
| Mount | Adhesive |
| Shape | Square, Fins |
| Width | 38.35mm |
| Finish | Anodized |
| Height | 9.02mm |
| Length | 38.354mm |
| Series | BDN |
| Material | Aluminium |
| Packaging | Bulk |
| Package Cooled | ASIC |
| RoHS Compliant | No |
| Package Quantity | 1 |
| Natural Thermal Resistance | 15.1°C/W |
| Thermal Resistance @ Forced Air Flow (100 LFM) | 4.5°C/W |
