BX80574L5410P SLAP4
Производится
Увеличить
Краткое описание:
64-bit 45nm 2.33GHz 4-Core MPU (FCLGA, 771-Pin)
Дополнительная информация
64-bit 4-core microprocessor featuring a 2.33GHz clock speed and 45nm process technology. This Flip-Chip Land Grid Array (FCLGA) package offers 771 pins with a 37.55mm maximum dimensions and 4.32mm seated plane height, designed for surface mounting. It includes 32KB instruction and 32KB data cache, with a maximum operating supply voltage range of 1.155V to 1.605V.
| CAN | 0 |
| I2C | 0 |
| I2S | 0 |
| PCB | 771 |
| SPI | 0 |
| USB | 0 |
| PPAP | No |
| UART | 0 |
| USART | 0 |
| EU RoHS | Yes with Exemption |
| Ethernet | 0 |
| HTS Code | 8542310001 |
| Mounting | Surface Mount |
| Cage Code | 4BA62 |
| Pin Count | 771 |
| Automotive | No |
| Lead Shape | No Lead |
| Schedule B | 8542310000 |
| Device Core | Xeon |
| Family Name | Xeon® Processor L5410 |
| Package/Case | FCLGA |
| AEC Qualified | No |
| Maximum Speed | 2330MHz |
| RoHS Versions | 2002/95/EC |
| Data Bus Width | 64bit |
| Interface Type | PECI |
| Pin Pitch (mm) | 1.09|1.17 |
| Data Cache Size | 32KB |
| Package Material | Plastic |
| Basic Package Type | Non-Lead-Frame SMT |
| Package Width (mm) | 37.55(Max) |
| Process Technology | 45nm |
| Multiply Accumulate | No |
| Number of CPU Cores | 4 |
| Package Description | Flip-Chip Land Grid Array |
| Package Family Name | LGA |
| Package Height (mm) | 4.32(Max) |
| Package Length (mm) | 37.55(Max) |
| Radiation Hardening | No |
| Instruction Cache Size | 32KB |
| Seated Plane Height (mm) | 4.32(Max) |
| Max Operating Supply Voltage | 1.155|1.35|1.605V |
Если у вас не открывается документ, нажмите, чтобы открыть файл в новой вкладке.
