BX80637I73770S SR0PN
Снят с производства
Увеличить
Краткое описание:
64-bit RISC MPU, 3.1GHz, 4-Core, 22nm, LGA, 1155-Pin
Дополнительная информация
64-bit RISC Microprocessor (MPU) featuring a 22nm process technology and a 3.1GHz maximum speed. This processor offers 4 CPU cores with a 32KB instruction cache and 32KB data cache. It utilizes a Flip-Chip Land Grid Array (FCLGA) package with 1155 pins, designed for surface mounting. The MPU operates at a maximum supply voltage of 1.52V and supports DMI/PECI interface types.
| CAN | 0 |
| I2C | 0 |
| I2S | 0 |
| PCB | 1155 |
| SPI | 0 |
| USB | 0 |
| ECCN | 5A992.c |
| PPAP | No |
| UART | 0 |
| USART | 0 |
| EU RoHS | Yes with Exemption |
| Ethernet | 0 |
| HTS Code | 8542310001 |
| Mounting | Surface Mount |
| Cage Code | 4BA62 |
| Pin Count | 1155 |
| Automotive | No |
| Lead Shape | No Lead |
| Schedule B | 8542310000 |
| Device Core | Core i7 |
| Family Name | Core™ i7-3770S Processor |
| Package/Case | FCLGA |
| AEC Qualified | No |
| Maximum Speed | 3100MHz |
| RoHS Versions | 2011/65/EU, 2015/863 |
| Data Bus Width | 64bit |
| Interface Type | DMI/PECI |
| Data Cache Size | 32KB |
| Package Material | Plastic |
| Core Architecture | i7 |
| Basic Package Type | Non-Lead-Frame SMT |
| Package Width (mm) | 37.5 |
| Process Technology | 22nm |
| Multiply Accumulate | No |
| Number of CPU Cores | 4 |
| Package Description | Flip-Chip Land Grid Array |
| Package Family Name | LGA |
| Package Length (mm) | 37.5 |
| Instruction Cache Size | 32KB |
| Instruction Set Architecture | RISC |
| Max Operating Supply Voltage | 1.52V |
Если у вас не открывается документ, нажмите, чтобы открыть файл в новой вкладке.
