CD74HC574M96
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Краткое описание:
HC D-Type Flip-Flop, 3-State, 20-Pin SOIC, Pos-Edge Trigger
Дополнительная информация
CMOS D-Type bus interface flip-flop, positive-edge triggered, featuring 8 non-inverting inputs and 8 3-state outputs. This single-element logic IC is housed in a 20-pin SOIC (Small Outline IC) package with gull-wing leads for surface mounting. The lead-frame SMT package, part of the SOP family, measures 13mm (Max) in length, 7.6mm (Max) in width, and 2.35mm (Max) in height, with a 1.27mm pin pitch. Operating across a temperature range of -55°C to 125°C, this plastic-encased component is designed for robust performance.
| PCB | 20 |
| ECCN | EAR99 |
| PPAP | No |
| Jedec | MS-013AC |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Mounting | Surface Mount |
| Polarity | Non-Inverting |
| Cage Code | 01295 |
| Pin Count | 20 |
| Automotive | No |
| Lead Shape | Gull-wing |
| Schedule B | 8542390000 |
| Output Type | 3-State |
| Logic Family | HC |
| Package/Case | SOIC |
| AEC Qualified | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
| Logic Function | D-Type Bus Interface |
| Pin Pitch (mm) | 1.27 |
| Triggering Type | Positive-Edge |
| Package Material | Plastic |
| Basic Package Type | Lead-Frame SMT |
| Package Width (mm) | 7.6(Max) |
| Process Technology | CMOS |
| Package Description | Small Outline IC |
| Package Family Name | SOP |
| Package Height (mm) | 2.35(Max) |
| Package Length (mm) | 13(Max) |
| Radiation Hardening | No |
| Number of Element Inputs | 8 |
| Seated Plane Height (mm) | 2.65(Max) |
| Max Operating Temperature | 125°C |
| Min Operating Temperature | -55°C |
| Number of Element Outputs | 8 |
| Number of Elements per Chip | 1 |
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