CY7C1475BV25-133BGXIT
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Краткое описание:
Sync SRAM 72M-bit 1M x 72-bit 2.5V 133MHz 6.5ns FBGA
Дополнительная информация
Synchronous SRAM chip offering 72M-bit density, organized as 1M words x 72 bits. Features a maximum access time of 6.5 ns and a maximum clock rate of 133 MHz with SDR data rate architecture. This surface-mount component utilizes a 209-pin Fine Pitch Ball Grid Array (FBGA) package with a 1mm pin pitch. Operates at a typical supply voltage of 2.5V, with a voltage range of 2.375V to 2.625V, and supports an 8-port, flow-through architecture. Extended temperature range from -40°C to 85°C.
| PCB | 209 |
| ECCN | 3A991.b.2.a |
| PPAP | No |
| Density | 72Mbit |
| EU RoHS | Yes |
| HTS Code | 8542320041 |
| Mounting | Surface Mount |
| Cage Code | 65786 |
| Pin Count | 209 |
| Automotive | No |
| Lead Shape | Ball |
| Schedule B | 8542320040 |
| Timing Type | Synchronous |
| Architecture | Flow-Through |
| Package/Case | FBGA |
| AEC Qualified | No |
| RoHS Versions | 2011/65/EU |
| Pin Pitch (mm) | 1 |
| Density in Bits | 75497472bit |
| Number of Ports | 8 |
| Number of Words | 1M |
| Package Material | Plastic |
| Address Bus Width | 20bit |
| Basic Package Type | Ball Grid Array |
| Maximum Clock Rate | 133MHz |
| Package Width (mm) | 14 |
| Maximum Access Time | 6.5ns |
| Package Description | Fine Pitch Ball Grid Array |
| Package Family Name | BGA |
| Package Height (mm) | 1.26 |
| Package Length (mm) | 22 |
| Data Rate Architecture | SDR |
| Number of Bits per Word | 72bit |
| Seated Plane Height (mm) | 1.76 |
| Max Operating Temperature | 85°C |
| Maximum Operating Current | 305mA |
| Min Operating Temperature | -40°C |
| Max Operating Supply Voltage | 2.625V |
| Min Operating Supply Voltage | 2.375V |
| Typical Operating Supply Voltage | 2.5V |
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