CY7C2563XV18-600BZXC
Производится
Увеличить
Краткое описание:
Sync Dual SRAM 72M-bit 4M x 18 600MHz 0.45ns 1.8V FBGA
Дополнительная информация
Synchronous SRAM chip, 72M-bit density, featuring a 4M x 18 configuration with a 20-bit address bus. Offers a maximum access time of 0.45 ns and a maximum clock rate of 600 MHz, utilizing a QDR data rate architecture. Operates at 1.8V typical supply voltage, with a range of 1.7V to 1.9V. Packaged in a 165-pin FBGA (Fine Pitch Ball Grid Array) for surface mounting, with dimensions of 15mm x 13mm x 0.89mm.
| PCB | 165 |
| ECCN | 3A991.b.2.a |
| PPAP | No |
| Density | 72Mbit |
| EU RoHS | Yes |
| HTS Code | 8542320041 |
| Mounting | Surface Mount |
| Cage Code | 65786 |
| Pin Count | 165 |
| Automotive | No |
| Lead Shape | Ball |
| Schedule B | 8542320040 |
| Timing Type | Synchronous |
| Architecture | Pipelined |
| Package/Case | FBGA |
| AEC Qualified | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
| Pin Pitch (mm) | 1 |
| Density in Bits | 75497472bit |
| Number of Ports | 2 |
| Number of Words | 4M |
| Package Material | Plastic |
| Address Bus Width | 20bit |
| Basic Package Type | Ball Grid Array |
| Maximum Clock Rate | 600MHz |
| Package Weight (g) | 0.49956 |
| Package Width (mm) | 13 |
| Maximum Access Time | 0.45ns |
| Package Description | Fine Pitch Ball Grid Array |
| Package Family Name | BGA |
| Package Height (mm) | 0.89 |
| Package Length (mm) | 15 |
| Data Rate Architecture | QDR |
| Number of Bits per Word | 18bit |
| Seated Plane Height (mm) | 1.4(Max) |
| Max Operating Temperature | 70°C |
| Maximum Operating Current | 1100mA |
| Min Operating Temperature | 0°C |
| Max Operating Supply Voltage | 1.9V |
| Min Operating Supply Voltage | 1.7V |
| Typical Operating Supply Voltage | 1.8V |
Если у вас не открывается документ, нажмите, чтобы открыть файл в новой вкладке.
