CYV15G0101DXB-BBXC
Дополнительная информация
| RoHS | Compliant |
| Mount | Surface Mount |
| Width | 11mm |
| Series | HOTlink II™ |
| Lead Free | Lead Free |
| Packaging | Tray |
| Technology | BICMOS |
| Package Code | LBGA |
| Package/Case | TBGA |
| Package Shape | Square |
| Surface Mount | Yes |
| Terminal Form | Ball |
| RoHS Compliant | Yes |
| Supply Current | 500mA |
| Terminal Finish | Copper |
| Package Quantity | 176 |
| Temperature Grade | COMMERCIAL |
| Terminal Position | BOTTOM |
| Max Supply Voltage | 3.465V |
| Min Supply Voltage | 3.135V |
| Number of Channels | 1 |
| Number of Functions | 1 |
| Radiation Hardening | No |
| Package Body Material | Plastic |
| Operating Supply Voltage | 3.3V |
| Max Operating Temperature | 70°C |
| Min Operating Temperature | 0°C |
| Moisture Sensitivity Level | 5 |
| Peak Reflow Temperature (Cel) | 260°C |
| Time @ Peak Reflow Temperature-Max (s) | 20s |
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