EP3CLS150F780C7N
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Краткое описание:
FPGA Cyclone III LS, 150K Logic Cells, 65nm, 780-Pin FBGA
Дополнительная информация
Field Programmable Gate Array (FPGA) with 150,848 logic cells and 5,994 Kbit RAM. Features 320 18x18 multipliers and operates at 437.5MHz with 65nm process technology and 1.2V voltage. Supports up to 413 user I/Os and offers external memory interfaces for DDR2 SDRAM and QDRII+ SRAM. Packaged in a 780-pin FBGA (29x29mm) for surface mounting, with a 1mm pin pitch.
| PCB | 780 |
| ECCN | 3A991 |
| PPAP | No |
| Jedec | MS-034AAM-1 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Mounting | Surface Mount |
| RAM Bits | 5994Kbit |
| Cage Code | 4BA62 |
| Pin Count | 780 |
| Automotive | No |
| Lead Shape | Ball |
| Schedule B | 8542390000 |
| Family Name | Cyclone® III LS |
| Speed Grade | 7 |
| Package/Case | FBGA |
| AEC Qualified | No |
| RoHS Versions | 2011/65/EU |
| Pin Pitch (mm) | 1 |
| Programmability | No |
| Package Material | Plastic |
| Supported IP Core | Viterbi Compiler, Low-Speed/Hybrid Serial Decoder|Public Key Crypto Engine (BA414E)| 32|64-bit PCI-X bus Master/Target interface Core, 66/100/133Mhz |
| Basic Package Type | Ball Grid Array |
| Device Logic Cells | 150848 |
| Package Width (mm) | 29 |
| Process Technology | 65nm |
| Package Description | Fine Pitch Ball Grid Array |
| Package Family Name | BGA |
| Package Height (mm) | 1.75 |
| Package Length (mm) | 29 |
| Program Memory Type | SRAM |
| Radiation Hardening | No |
| Number of Multipliers | 320 (18x18) |
| Seated Plane Height (mm) | 2.25 |
| External Memory Interface | DDR2 SDRAM|QDRII+SRAM |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | 0°C |
| Total Number of Block RAM | 666 |
| Device Number of DLLs/PLLs | 4 |
| Maximum Number of User I/Os | 413 |
| Supported IP Core Manufacture | Altera/CAST, Inc/Barco Silex/PLDA |
| Differential I/O Standards Supported | LVPECL|LVDS|HSTL-18|HSTL-15|HSTL-12|SSTL-2|SSTL-18|RSDS |
| Single-Ended I/O Standards Supported | LVTTL|LVCMOS|PCI|PCI-X|SSTL|HSTL |
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