EP3CLS200F780I7N

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EP3CLS200F780I7N - Intel
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Краткое описание: FPGA Cyclone III LS, 198K Cells, 65nm, 780-Pin FBGA, 413 I/O
Производитель Intel
Статус производства Производится (ACTIVE)

Дополнительная информация

Field Programmable Gate Array (FPGA) with 198,464 logic cells and 413 user I/Os. Features 8019 Kbit RAM, 396 multipliers (18x18), and 891 Block RAM. Operates on 1.2V with 65nm process technology, supporting DDR2 SDRAM and QDRII+ SRAM external memory interfaces. Housed in a 780-pin FBGA package (29x29mm) for surface mounting, with a temperature range of -40°C to 100°C. Supports multiple differential and single-ended I/O standards.
PCB 780
ECCN 3A991
PPAP No
Jedec MS-034AAM-1
EU RoHS Yes
HTS Code 8542390001
Mounting Surface Mount
RAM Bits 8019Kbit
Cage Code 4BA62
Pin Count 780
Automotive No
Lead Shape Ball
Schedule B 8542390000
Family Name Cyclone® III LS
Speed Grade 7
Package/Case FBGA
AEC Qualified No
RoHS Versions 2011/65/EU, 2015/863
Pin Pitch (mm) 1
Programmability No
Package Material Plastic
Supported IP Core Viterbi Compiler, Low-Speed/Hybrid Serial Decoder|Public Key Crypto Engine (BA414E)| 32|64-bit PCI-X bus Master/Target interface Core, 66/100/133Mhz
Basic Package Type Ball Grid Array
Device Logic Cells 198464
Package Width (mm) 29
Process Technology 65nm
Package Description Fine Pitch Ball Grid Array
Package Family Name BGA
Package Height (mm) 1.75
Package Length (mm) 29
Program Memory Type SRAM
Radiation Hardening No
Number of Multipliers 396 (18x18)
Seated Plane Height (mm) 2.25
External Memory Interface DDR2 SDRAM|QDRII+SRAM
Max Operating Temperature 100°C
Min Operating Temperature -40°C
Total Number of Block RAM 891
Device Number of DLLs/PLLs 4
Maximum Number of User I/Os 413
Supported IP Core Manufacture Altera/CAST, Inc/Barco Silex/PLDA
Differential I/O Standards Supported LVPECL|LVDS|HSTL-18|HSTL-15|HSTL-12|SSTL-2|SSTL-18|RSDS
Single-Ended I/O Standards Supported LVTTL|LVCMOS|PCI|PCI-X|SSTL|HSTL

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