EP4CGX50CF27C8N

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EP4CGX50CF27C8N - Intel
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Краткое описание: FPGA 49888 Cells 60nm 672-Pin FBGA 310 I/O 2502Kbit RAM
Производитель Intel
Статус производства Производится (ACTIVE)

Дополнительная информация

Field Programmable Gate Array (FPGA) with 49,888 logic cells and 2502 Kbit RAM. This device features 60nm process technology, 310 user I/Os, and 2 Ethernet MACs. It supports up to 3.125 Gbps transceiver speeds across 8 transceiver blocks and includes 1 PCI block. The FPGA is housed in a 672-pin FBGA package with a 1mm pin pitch, suitable for surface mounting. Operating temperature range is 0 °C to 85 °C.
PCB 672
ECCN 3A991.d
PPAP No
Jedec MS-034AAL-1
EU RoHS Yes
HTS Code 8542390001
Mounting Surface Mount
RAM Bits 2502Kbit
Cage Code 4BA62
Pin Count 672
Automotive No
Lead Shape Ball
PCI Blocks 1
Schedule B 8542390000
Family Name Cyclone® IV GX
Speed Grade 8
Package/Case FBGA
AEC Qualified No
Ethernet MACs 2
RoHS Versions 2011/65/EU
Pin Pitch (mm) 1
Programmability Yes
Package Material Plastic
Supported IP Core Viterbi Compiler, Low-Speed/Hybrid Serial Decoder|Sub-frame Latency JPEG 2000 Encoder (BA130)|PCI Express to AXI Bridge Controller (GPEX-PAB)|ISA/PC Card/PCMCIA/Compact Flash Host Adapter
Transceiver Speed 3.125Gbps
Basic Package Type Ball Grid Array
Device Logic Cells 49888
Package Width (mm) 27
Process Technology 60nm
Transceiver Blocks 8
Package Description Fine Pitch Ball Grid Array
Package Family Name BGA
Package Height (mm) 2.2(Max)
Package Length (mm) 27
Program Memory Type SRAM
Radiation Hardening No
Number of Multipliers 140 (18x18)
Seated Plane Height (mm) 2.6(Max)
External Memory Interface DDR2 SDRAM|QDRII+SRAM
Max Operating Temperature 85°C
Min Operating Temperature 0°C
Total Number of Block RAM 278
Device Number of DLLs/PLLs 4
Maximum Number of User I/Os 310
Supported IP Core Manufacture Altera/CAST, Inc/Barco Silex/Mobiveil, Inc/Eureka Technology Inc
Differential I/O Standards Supported B-LVDS|HSTL|LVPECL|LVDS|RSDS|SSTL
Single-Ended I/O Standards Supported LVTTL|LVCMOS|PCI|PCI-X|SSTL|HSTL

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