EP4CGX50DF27I8ES

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EP4CGX50DF27I8ES - Intel
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Краткое описание: FPGA Cyclone IV GX 49888 Cells 60nm 310 I/O 672-Pin FBGA
Производитель Intel
Статус производства Производится (ACTIVE)

Дополнительная информация

Field-Programmable Gate Array (FPGA) featuring 49,888 logic cells and 2502 Kbit of RAM, built on 60nm process technology. This device offers 310 user I/Os, two Ethernet MACs, 140 multipliers (18x18), and eight transceiver blocks operating at 3.125 Gbps. It supports various I/O standards including LVTTL, LVCMOS, B-LVDS, HSTL, and LVPECL, with external memory interfaces for DDR2 SDRAM and QDRII+SRAM. The FPGA is housed in a 672-pin Fine Pitch Ball Grid Array (FBGA) package, measuring 27x27mm with a 1mm pin pitch, designed for surface mounting and operating within a temperature range of -40°C to 100°C.
PCB 672
ECCN 3A991.d
PPAP No
Jedec MS-034AAL-1
EU RoHS No
HTS Code 8542390001
Mounting Surface Mount
RAM Bits 2502Kbit
Cage Code 4BA62
Pin Count 672
Automotive No
Lead Shape Ball
PCI Blocks 1
Schedule B 8542390000
Family Name Cyclone® IV GX
Speed Grade 8
Package/Case FBGA
AEC Qualified No
Ethernet MACs 2
RoHS Versions 2011/65/EU, 2015/863
Pin Pitch (mm) 1
Programmability Yes
Package Material Plastic
Supported IP Core Viterbi Compiler, Low-Speed/Hybrid Serial Decoder|Sub-frame Latency JPEG 2000 Encoder (BA130)|PCI Express to AXI Bridge Controller (GPEX-PAB)|ISA/PC Card/PCMCIA/Compact Flash Host Adapter
Transceiver Speed 3.125Gbps
Basic Package Type Ball Grid Array
Device Logic Cells 49888
Package Width (mm) 27
Process Technology 60nm
Transceiver Blocks 8
Package Description Fine Pitch Ball Grid Array
Package Family Name BGA
Package Height (mm) 1.75
Package Length (mm) 27
Program Memory Type SRAM
Radiation Hardening No
Number of Multipliers 140 (18x18)
Seated Plane Height (mm) 2.25
External Memory Interface DDR2 SDRAM|QDRII+SRAM
Max Operating Temperature 100°C
Min Operating Temperature -40°C
Total Number of Block RAM 278
Device Number of DLLs/PLLs 4
Maximum Number of User I/Os 310
Supported IP Core Manufacture Altera/CAST, Inc/Barco Silex/Mobiveil, Inc/Eureka Technology Inc
Differential I/O Standards Supported B-LVDS|HSTL|LVPECL|LVDS|RSDS|SSTL
Single-Ended I/O Standards Supported LVTTL|LVCMOS|PCI|PCI-X|SSTL|HSTL

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