GP3004SF-0.030-01-0918
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Краткое описание:
BERGQUIST GAP PAD TGP 3004SF, 3.0 W/m-K, Silicone-Free, 0.030" Thickness
Дополнительная информация
BERGQUIST GAP PAD TGP 3004SF is a high-performance, silicone-free thermal interface material designed for silicone-sensitive applications. It features a thermal conductivity of 3.0 W/m-K and exhibits exceptionally low interfacial resistance. The material is reinforced with a 0.25 mil PET film carrier for improved handling and is compliant with UL 94 V-0 flame ratings.
| Color | Light Gray |
| Density | 3.2g/cm³ |
| Hardness | 70Shore 00 |
| Thickness | 0.030inch |
| Dimensions | 9 x 18inch |
| Carrier Type | 0.25 PET Filmmil |
| Flame Rating | UL 94 V-0 |
| Silicone Content | Silicone-Free |
| Thermal Conductivity | 3.0W/m-K |
| Operating Temperature | -40 to 125°C |