GS8662DT07BGD-333I

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GS8662DT07BGD-333I - GSI
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Краткое описание: Sync SRAM 72M-bit 8M x 8 1.8V 333MHz QDR FBGA 165-Pin
Производитель GSI
Статус производства Производится (ACTIVE)

Дополнительная информация

Synchronous SRAM chip, 72M-bit density, featuring a dual-port architecture with 8M words x 8 bits per word. Offers a maximum access time of 0.45 ns and a maximum clock rate of 333 MHz, utilizing a QDR data rate architecture. Packaged in a 165-pin Fine Pitch Ball Grid Array (FBGA) with a 15mm x 13mm footprint and 1mm pin pitch, designed for surface mounting. Operates with a typical supply voltage of 1.8V, ranging from 1.7V to 1.9V, and supports a temperature range of -40°C to 100°C.
PCB 165
ECCN 3A991.b.2.b
PPAP No
Density 72Mbit
EU RoHS Yes
HTS Code 8542320041
Mounting Surface Mount
Cage Code 3BKC7
Pin Count 165
Automotive No
Lead Shape Ball
Schedule B 8542320040
Timing Type Synchronous
Architecture Pipelined
Package/Case FBGA
AEC Qualified No
RoHS Versions 2011/65/EU, 2015/863
Pin Pitch (mm) 1
Density in Bits 75497472bit
Number of Ports 2
Number of Words 8M
Package Material Plastic
Address Bus Width 21bit
Basic Package Type Ball Grid Array
Maximum Clock Rate 333MHz
Package Width (mm) 13
Maximum Access Time 0.45ns
Package Description Fine Pitch Ball Grid Array
Package Family Name BGA
Package Height (mm) 0.94(Max)
Package Length (mm) 15
Data Rate Architecture QDR
Number of Bits per Word 8bit
Seated Plane Height (mm) 1.4(Max)
Max Operating Temperature 100°C
Maximum Operating Current 640mA
Min Operating Temperature -40°C
Max Operating Supply Voltage 1.9V
Min Operating Supply Voltage 1.7V
Typical Operating Supply Voltage 1.8V