GS8662DT07BGD-350I
Производится
Увеличить
Краткое описание:
Sync SRAM 72M-bit 8M x 8 350MHz QDR FBGA 165-Pin 1.8V
Дополнительная информация
Synchronous SRAM chip, 72M-bit density, featuring an 8M x 8 configuration with a 21-bit address bus. Achieves a maximum access time of 0.45 ns and a maximum clock rate of 350 MHz, utilizing a QDR data rate architecture. Operates with a typical supply voltage of 1.8V, within a 1.7V to 1.9V range. Packaged in a 165-pin Fine Pitch Ball Grid Array (FBGA) with a 15mm x 13mm footprint, suitable for surface mounting.
| PCB | 165 |
| ECCN | 3A991.b.2.b |
| PPAP | No |
| Density | 72Mbit |
| EU RoHS | Yes |
| HTS Code | 8542320041 |
| Mounting | Surface Mount |
| Cage Code | 3BKC7 |
| Pin Count | 165 |
| Automotive | No |
| Lead Shape | Ball |
| Schedule B | 8542320040 |
| Timing Type | Synchronous |
| Architecture | Pipelined |
| Package/Case | FBGA |
| AEC Qualified | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
| Pin Pitch (mm) | 1 |
| Density in Bits | 75497472bit |
| Number of Ports | 2 |
| Number of Words | 8M |
| Package Material | Plastic |
| Address Bus Width | 21bit |
| Basic Package Type | Ball Grid Array |
| Maximum Clock Rate | 350MHz |
| Package Width (mm) | 13 |
| Maximum Access Time | 0.45ns |
| Package Description | Fine Pitch Ball Grid Array |
| Package Family Name | BGA |
| Package Height (mm) | 0.94(Max) |
| Package Length (mm) | 15 |
| Data Rate Architecture | QDR |
| Number of Bits per Word | 8bit |
| Seated Plane Height (mm) | 1.4(Max) |
| Max Operating Temperature | 100°C |
| Maximum Operating Current | 705mA |
| Min Operating Temperature | -40°C |
| Max Operating Supply Voltage | 1.9V |
| Min Operating Supply Voltage | 1.7V |
| Typical Operating Supply Voltage | 1.8V |
Если у вас не открывается документ, нажмите, чтобы открыть файл в новой вкладке.
