HMT325S6BFR6C-H9
Снят с производства
Краткое описание:
DDR3 2GB 1333MHz 204-Pin USODIMM RAM Module
Дополнительная информация
DDR3 SDRAM module offering 2GB total density with a 240SODIMM form factor. Features a 64-bit data bus width, dual ranks, and 8 chips per module organized as 256Mx64. Operates at a maximum clock rate of 1333 MHz with a CAS latency of 9, utilizing a typical operating supply voltage of 1.5V. The USODIMM package is a non-lead-frame SMT type with 204 pins and a 0.6mm pin pitch, designed for socket mounting.
| PCB | 204 |
| ECCN | EAR99 |
| PPAP | No |
| EU RoHS | Yes |
| HTS Code | 8473301140 |
| Mounting | Socket |
| Cage Code | 9162F |
| Pin Count | 204 |
| Automotive | No |
| Lead Shape | No Lead |
| Schedule B | 8473300002 |
| CAS Latency | 9 |
| ECC Support | No |
| Module Type | 240SODIMM |
| Subcategory | DDR3 SDRAM |
| Chip Density | 2Gbit |
| Organization | 256Mx64 |
| Package/Case | USODIMM |
| AEC Qualified | No |
| Main Category | DRAM Module |
| RoHS Versions | 2002/95/EC |
| Total Density | 2Gbyte |
| Data Bus Width | 64bit |
| Pin Pitch (mm) | 0.6 |
| Number of Ranks | Dual |
| Basic Package Type | Non-Lead-Frame SMT |
| Chip Configuration | 128Mx16 |
| Maximum Clock Rate | 1333MHz |
| Package Width (mm) | 3.8(Max) |
| Package Description | Unbuffered Small Outline Dual In Line Memory Module |
| Package Family Name | DIM |
| Package Height (mm) | 30 |
| Package Length (mm) | 67.6 |
| Radiation Hardening | No |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | 0°C |
| Number of Chip per Module | 8 |
| Max Operating Supply Voltage | 1.575V |
| Min Operating Supply Voltage | 1.425V |
| Typical Operating Supply Voltage | 1.5V |
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