This aluminum heat sink is a passive device with a pin array fin style. It is designed for BGA device cooling and can be attached to a panel using a clip or thermal tape. The heat sink measures 27mm in length and 7.1mm in height, making it suitable for various thermal management applications.
| RoHS |
Yes |
| Type |
Passive |
| Height |
7.1mm |
| Material |
Aluminum |
| Mounting |
Panel Mount |
| Fin Style |
Pin Array |
| RoHS Version |
2011/65/EU, 2015/863 |
| Device Cooled |
BGA |
| Product Depth |
27mm |
| Product Length |
27mm |
| Attachment Method |
Clip|Thermal Tape |